Board Size: 10cm x 15cm
Type: Double-sided
Hole Pitch: 2.54mm
Hole Diameter: 1.0mm
Material: FR-4 (Fiberglass Epoxy Laminate)
Thickness: 1.6mm
Copper Layer Thickness: 35μm (1oz/ft²)
Surface Finish: HASL (Hot Air Solder Leveling)
Pad Layout: Standard grid layout
Number of Holes: Approximately 2360
Solder Mask: Green
Silkscreen: White
Flame Retardant: Yes, UL94V-0
Maximum Operating Temperature: 140°C
RoHS Compliant: Yes
SKU: RW-1264
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